| 标题 |
Multi-physics coupled modeling of process-induced warpage in advanced fan-out wafer-level semiconductor packages |
| 网址 | |
| DOI | |
| 其它 |
期刊:Journal of Manufacturing Processes 作者:Jeong-Hyeon Baek; Jun-Seop Song; Woong-Kyoo Yoo; Woo-Jin An; Gyung-Hwan Oh; et al 出版日期:2026-09-01 |
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(2025-6-4)