| 标题 |
Prospective application of nanotwinned copper for Damascene via filling and hybrid bonding |
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| DOI | |
| 其它 |
期刊:2023 24th International Conference on Electronic Packaging Technology (ICEPT) 作者:Li-Yin Gao; Yong-Qiang Wan; Zhi-Gang Lei; Yu-Xi Wang; Zhe Li; et al 出版日期:2024-04-12 |
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(2025-6-4)