| 标题 |
Study of chucking force distribution according to substrate pattern and deformation characteristics of electrostatic chuck for deposition |
| 网址 | |
| DOI | |
| 其它 |
期刊:Journal of Electrostatics 作者:Seong Bin Kim; Ju Hye Kim; Dong Kyun Min 出版日期:2025-01-01 |
| 求助人 | |
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(2025-6-4)