| 标题 |
Reworkable epoxy underfills with optimized curing and flow behavior for advanced electronic packaging |
| 网址 | |
| DOI | |
| 其它 |
期刊:Soldering & Surface Mount Technology 作者:Muhamed Abdul Fatah Muhamed Mukhtar; Jia Xin Phang; Nor Rashikin Abd Khalid; Muhammad Khalil Abdullah; Mohamad Riduwan Ramli 出版日期:2026-04-07 |
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(2025-6-4)