| 标题 |
3D Orthogonal Die Stacking Technology for DRAM-on-GPU Integration Using Contactless Die-to-Die Interface |
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期刊:2026 IEEE/JSAP Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits) 作者:Yuki Mitarai; Masaya Kawano; Hung-Chih Huang; Takafumi Fukushima; Tadahiro Kuroda; et al 出版日期:2026-07-04 |
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(2025-6-4)