| 标题 |
Thermo-compression bonding process characteristics and shape control of Cu-pillar microbump joints by optimizing of solder melting |
| 网址 | |
| DOI | |
| 其它 |
期刊:Journal of Materials Science: Materials in Electronics 作者:Mingang Fang; Chu Tang; Yiming Chen; Junhui Li; Zhuo Chen; et al 出版日期:2022-03-23 |
| 求助人 | |
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(2025-6-4)