| 标题 |
Coupling model of electromigration and experimental verification – Part II: Impact of thermomigration |
| 网址 | |
| DOI | |
| 其它 |
期刊:Journal of the Mechanics and Physics of Solids 作者:Zhen Cui; Xuejun Fan; Yaqian Zhang; Sten Vollebregt; Jiajie Fan; et al 出版日期:2023-03-05 |
| 求助人 | |
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(2025-6-4)