| 标题 |
Hygrothermal analysis for the electrochemical migration failure in multi-chip packages during a highly accelerated stress test |
| 网址 | |
| DOI | |
| 其它 |
期刊:2012 14th International Conference on Electronic Materials and Packaging (EMAP) 作者:Jongguk Choe; Jae-Won Jang; Nam-Seog Kim; Soon-Bok Lee 出版日期:2012-12-01 |
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(2025-6-4)