| 标题 |
Characterization and reduction of copper chemical-mechanical-polishing-induced scratches |
| 网址 | |
| DOI | |
| 其它 |
期刊:Process and Materials Characterization and Diagnostics in IC Manufacturing 作者:Kenneth W. Tobin, Jr.; Tai Yong Teo; Iraj Emami; Wang Ling Goh; Lup San Leong; et al 出版日期:2003 |
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(2025-6-4)