Automatic Visual Inspection of Bump in Flip Chip using Edge Detection with Genetic Algorithm

Abstract—This paper presents the development of an automatic visual inspection machines for inspecting the soldering points (called as “Bump”) in a “Flip-Chip ” component which is an important part of a hard disk drive (HDD). Image feature extraction is used to measure the interesting features such as bump area, bump ratio, and etc. from the X-ray input image. Accuracy of the proposed measuring system is verified by comparing with the measured value from the destructive inspection. Genetic Algorithm are used to detect the edge of bump. Experimental results show that our proposed developed inspection machine is effectively used for bump inspection. Index Terms — Image processing, Visual inspection, Genetic algorithm, Edge detection