材料科学
电阻率和电导率
微观结构
抗弯强度
大气温度范围
复合材料
热导率
粒度
热等静压
各向异性
陶瓷
热压
晶粒生长
矿物学
化学
热力学
量子力学
物理
电气工程
工程类
作者
Yinjuan Bai,Xiaodong He,Chuncheng Zhu,Guiqing Chen
标识
DOI:10.1111/j.1551-2916.2011.04934.x
摘要
The microstructure and the electrical, thermal, and mechanical properties of bulk Ti 2 AlC synthesized by self‐propagating high‐temperature combustion synthesis with pseudo hot isostatic pressing ( SHS / PHIP ) were investigated in detail. The plate‐like Ti 2 AlC grains distribute irregularly, with the grain size of around 6 μm in length and 1 μm in width. With increasing temperature, the electrical resistivity increases linearly from room temperature ( RT ) to 900°C, but the thermal conductivity decreases slightly. The RT electrical resistivity and thermal conductivity are 0.40 ± 0.03 μΩ·m and 27.0 W·(m·K) −1 , respectively. The electronic component of the thermal conductivity is the dominant mechanism at all temperatures, and the phonon contribution almost can be neglected above 873 K. With increasing temperature, the flexural strength increases first, then decreases above 550°C, at which it reaches the maximum value of 539 ± 36 MPa. The brittle‐to‐plastic transition temperature falls in the temperature range of 750°C–950°C. The Ti 2 AlC synthesized by SHS / PHIP process exhibits an anisotropic compressive strength. The work of fracture of Ti 2 AlC is estimated to be 200 ± 7 J/m 2 , which is much higher than that of traditional ceramics.
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