The curing mechanism and properties of bismaleimide–biscyanamide resin

Abstract Thermoset networks consisting of N, N ‐bismaleimidediphenylmethane (BMI) and bis [4‐(4‐cyanamide‐3‐methylphenyl)] methane (BCMM) were investigated with the aim of correlating macroscopic behavior and structure as network composition was varied. The glass transition temperatures of these cured resins obtained from the dynamic mechanical data and thermal expansion data had a distinct minimum at the 50/50 molar ratio of BMI/BCMM. Also, at this molar ratio, the decomposition temperature at a 5% weight loss in helium atmosphere for cured resins was the lowest. These results provided a rough idea of the thermoset network structure.