Tutorial: HBM DRAM and 3D Stacked Memory

The proliferation of machine-learning workloads has accelerated the demand for higher memory bandwidth in modern systems. HBM DRAM was developed to break through the system-performance limit caused by memory bandwidth. With advanced packaging technology, HBM has been the only scalable DRAM bandwidth solution of the past 10 years, starting from 128GB/s and now extending beyond 800GB/s. This tutorial will cover HBM, HBM2, and HBM3 architectures; it will also cover historical trends and state-of-the-art for DRAM. Electrical interfaces and PDN for 2.5D system-in-package (SiP) structures will be reviewed, along with heterogeneous memory structures, including TSV interfaces. This tutorial will also cover the various design methods such as known-good-stack verification, self-repair, MBIST and RAS features, to deal with the new package structures. Finally, advanced 3D memory architectures including future trends of HBM, will be introduced.