Method of Improving Simulation Accuracy by Curing Shrinkage of Molding Compound

Packaging strip warpage in the molding process is one of the important indicators of electronic packaging reliability evaluation. There are many factors affecting packaging strip warpage, including the mismatch of material thermal expansion coefficient in the cooling process, the chemical shrinkage of epoxy molding compound (EMC) in the molding process and the stress relaxation effect in the post molding curing (PMC) process of molding material. The research shows that the chemical shrinkage of epoxy molding compound in the packaging process has a great impact on the packaging strip warpage, especially the treatment of the shrinkage of molding material of capillary underfill (CUF). At present, there is no accurate method. In this paper, the calculation method of Cure CTE is determined through the experimental method. Using Cure CTE + Mean CTE can effectively improve the strip warpage simulation in the post curing process of epoxy molding compound. The measured strip warpage values are in good agreement with the finite element simulation results.