光电探测器
宽带
光电子学
异质结
拓扑绝缘体
范德瓦尔斯力
材料科学
物理
光学
凝聚态物理
量子力学
分子
作者
Lijian Li,Peng Guo,Wenjie Li,Yun Wei,Qinzhi Zhao,Peng Wan,Caixia Kan,Da Ning Shi,Mingming Jiang
出处
期刊:ACS Photonics
[American Chemical Society]
日期:2025-07-08
卷期号:12 (8): 4512-4523
被引量:1
标识
DOI:10.1021/acsphotonics.5c00932
摘要
Weyl semiconductor Te holds great promise for next-generation optoelectronics due to its ultrahigh carrier mobility and unique topological surface states. However, its practical application is hindered by challenges such as the lack of scalable wafer-scale manufacturing methods for uniform films and high dark current. This study reports an in situ deposition strategy enabling wafer-scale fabrication of 64-pixel GaAs/Te van der Waals heterojunction (vdWH) arrays, achieving ultrawide-band photoresponse from solar-blind to near-infrared. Especially upon 1050 nm illumination, a GaAs/Te unit device exhibits superior performance, including an impressive responsivity of 55 mA/W, a specific detectivity of 2 × 1012 Jones, and a fast response speed of 2.6/5.1 ms at 0 V bias. Owing to the strong in-plane anisotropy of the Te layer, the detector achieves an anisotropy ratio of 2.57 at 1050 nm. The enhanced performance primarily stems from Te’s topological surface state, which enables robust interlayer coupling with GaAs while effectively suppressing interfacial defects. The GaAs/Te array architecture, enabled by its remarkable spatial uniformity in the pixel arrangement, demonstrates exceptional potential for polarization-encrypted imaging and pixel-level multispectral fusion technologies. Significantly, the implementation of topological vdW contact engineering, coupled with wafer-scale synthesis of Weyl semiconductor Te, establishes a transformative platform for advancing next-generation optoelectronic systems and CMOS-integrated photonic devices.
科研通智能强力驱动
Strongly Powered by AbleSci AI