Fabrication of Thin Copper Anode Current Collectors on Ceramic Solid Electrolytes Using Atmospheric Plasma Spraying for Anode-Free Solid-State Batteries

材料科学 阳极 集电器 电解质 石墨 陶瓷 冶金 制作 母材 电接点 复合材料 阴极 电极 金属 镀铜 电镀(地质) 碳纤维 同质性(统计学) 等离子体 导电体 化学工程 炭黑 电解法 原子扩散
作者
Andre Borchers,Timo Paschen,Manuela Ockel,Florian Vollnhals,Cornelius Dirksen,Martin Muckelbauer,Berik Uzakbaiuly,George Sarau,Jörg Franke,S Christiansen
出处
期刊:Batteries [Multidisciplinary Digital Publishing Institute]
卷期号:12 (4): 142-142
标识
DOI:10.3390/batteries12040142
摘要

Metal anodes offer substantially higher specific and volumetric capacities than conventional anode materials such as graphite in lithium-ion batteries or hard carbon in sodium-ion batteries. However, the integration of metal anodes into solid-state batteries poses significant challenges, particularly with respect to processing, interfacial stability, and cell assembly. Anode-free solid-state batteries (AFSSBs) address these challenges by eliminating the pre-installed metal anode, instead forming the metal in situ during the initial charging (formation) step. In anode-free solid-state batteries, the quality of the interfacial contact is particularly critical, as insufficient contact can lead to locally increased current densities. Consequently, the initial metal plating during the formation step plays a decisive role in determining the homogeneity and stability of the anode interface. Furthermore, conventional battery-grade copper foils (~10 µm) are considerably thicker than required for the targeted C-rates and are difficult to use as stand-alone anode-free current collectors, thereby hindering the industrial production of anode-free solid-state batteries. In this publication, we demonstrate the application of atmospheric plasma spraying (APS) to fabricate thin copper current collectors directly on the ceramic solid electrolytes LAGP (lithium aluminium germanium phosphate) and BASE (beta-alumina solid electrolyte) with superior interface contact. No mechanical damage or diffusion of copper into the solid electrolyte nor formation of secondary phases at the interfaces were observed in SEM or EDS despite the elevated process temperature. LAGP with a thickness as low as 300 µm was successfully coated and subsequently used for plating/stripping experiments. Finally, dense sodium metal was plated at the copper-substrate interface of a 1.4 mm thick BASE sample.
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