石墨烯
蚀刻(微加工)
反应离子刻蚀
材料科学
纳米技术
化学气相沉积
等离子体刻蚀
感应耦合等离子体
各向同性腐蚀
纳米材料
图层(电子)
干法蚀刻
表面粗糙度
等离子体处理
等离子体
光电子学
复合材料
物理
量子力学
出处
期刊:Current graphene science
[Bentham Science]
日期:2018-07-12
卷期号:2 (1): 15-20
被引量:6
标识
DOI:10.2174/2452273202666180711103739
摘要
Background: A new nanomaterial species called “graphene” has been of great interest owing to its outstanding mechanical, thermal, chemistry, and physical characteristics. The etching either directly from chemical vapor deposition growth process or plasma technology process has been emerging as attracting research topic in achieving the thinner graphene layer and cleaner surface in order to improve their electronics and optoelectronics. The resided impurities and the high roughness surface are because of the nature of graphenes induced in deteriorating the performance. Removal of the impurities by surface cleaning or plasma-related graphene etching through the layer-by-layer thinning method as a top-down lithography. In particular, new plasma-based graphene etching is freedamage while maintaining its π-binding, which affects its conductivity. Objective: This mini-review will address the latest progress related to graphene etching technology based on emerging strategies. From here, it might be adopted in the etching of other nanomaterials. Keywords: Atomic layer etching (ALE), chemical vapor deposition (CVD), graphene etching, inductively coupled plasma (ICP), ion beam, neutral beam, plasma, reactive ion etching (RIE).
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