铜
材料科学
热导率
热的
阴极射线
冶金
纳米技术
复合材料
电子
热力学
物理
量子力学
作者
P. Frigola,Ola Harrysson,Tim Horn,Harvey West,Ron Aman,J. M. Rigsbee,D.A. Ramirez,L.E. Murr,Francisco Medina,Ryan B. Wicker,Emmanuel Rodriguez
标识
DOI:10.31399/asm.amp.2014-07.p020
摘要
Abstract The ability to make components from copper and copper alloys via additive manufacturing is spurring a range of novel applications. Although the high thermal conductivity of copper presents challenges for direct AM processes, fully dense copper components with complex geometries have been demonstrated. Of particular interest is the ability to use AM methods to fabricate internal cooling channels and mesh structures to optimize thermal management. This article describes feasibility studies to evaluate AM processing of copper parts.
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