单层
晶体管
材料科学
光电子学
缩放比例
接触电阻
CMOS芯片
频道(广播)
半导体
场效应晶体管
纳米技术
半导体器件
纳米电子学
薄膜晶体管
MOSFET
等效串联电阻
工作(物理)
作者
Aocheng Qiu,Xiong Xiong,X. Q. Wang,Yuhang Chen,Yuzhe Zhu,Shiyuan Liu,Tianyue Fu,Yanqing Wu
标识
DOI:10.1109/iedm50572.2025.11353794
摘要
Two-dimensional (2D) semiconductors offer great promise for ultimate transistor scaling, with significant progress already demonstrated in n-FETs based on MoS2. However, high-performance p-type 2D transistors under aggressive pitch scaling remain insufficiently explored. In this work, we systematically investigate ultra-scaled monolayer WSe2p-type transistors, achieving full-dimensional scaling of channel length, width, and contact length. A record contact pitch of 53 nm is demonstrated, with LC=20 nm and LCH=33 nm. The scaled device with a 100 nm channel width exhibits a high on-current of 350 μA/μm at Vds=-1 V. Meanwhile, devices with a contact length of 200 nm achieve a lower contact resistance (RC) of 0.61 kΩ•μm and an on-current exceeding 1195 μA/μm at Vds=-1 V. This work indicates the tremendous potential of WSe2p-type transistors for ultra-scaled CMOS technologies.
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