Roll-to-roll flexible back-contacted c-Si PV modules: performance analysis and impact of mechanical and thermal stress

层压 材料科学 光伏 热的 过程(计算) 焊接 聚对苯二甲酸乙二醇酯 压力(语言学) 太阳能 机械工程 复合材料 太阳能电池 工作温度 汽车工程 计算机科学 堆栈(抽象数据类型) 结构工程 高效能源利用 铅(地质) 光伏系统 太阳增益
作者
P. Jakuza,G. Garbelotto,A Caria,N. Trivellin,M. Buffolo,Carlo De Santi,Stefano Rampino,Francesco Pattini,G. Meneghesso,E. Zanoni,M. Meneghini
出处
期刊:Solar Energy [Elsevier BV]
卷期号:317: 114974-114974
标识
DOI:10.1016/j.solener.2026.114974
摘要

Flexible crystalline-silicon photovoltaics (Fc-SiPV) have recently attracted attention, because they enable solar energy production in applications where lightweight and bendable panels are preferred. However, the lamination process for glass-free solar cells must be carefully optimized, to prevent cracking; in addition, the impact of cracks that form after lamination needs to be investigated, to fully understand how field-induced damage may affect performance and reliability. In this study, we propose a glass-free module architecture with polyethylene terephthalate (PET) as front cover resulting in lightweight modules with crystalline silicon solar cells. We focused on the effectiveness of the roll-to-roll lamination process, on the evaluation of cell performance before and after lamination, and on the role of cracked cells in series-connected mini-modules under different operating conditions. We found that: i) the main efficiency losses are optical in nature, resulting from increased reflections; ii) the lamination does not induce new cracks or electrical damage, but can promote the propagation of pre-existing cracks, typically originating from stress-concentrated regions such as soldering pads; iii) we analyzed mini-modules with damaged (cracked) cells in order to assess what would be the impact of cell damage on module performance when installed outdoor on curved surfaces. These results demonstrate how a low-cost roll-to-roll process can be adopted to fabricate mechanical resilient flexible c-Si mini-modules, while providing new insights into dynamic hot spot formation and current re-distribution governed by crack propagation.
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