Combined Footprint with Jet Printing and Soldering in the Vapor Phase

The paper presents how a combined footprint of two or more solder pastes is obtained using a jet printer. When using the Pin in Paste (PiP) technology with over printing, two problems arise - obtaining solder balls outside the solder pads and not everywhere melting of the solder paste. To avoid these problems, a combined footprint of two solder pastes could be used, which can reduce the melting temperature and collect the solder material in the pad. Combined footprints were realized by means of a Jet printer on different pads with different content of the two solder pastes. Using the reflow process in the vapor phase, the soldering was performed. The research also was studied and evaluated how the solder material melted in different sized pads and with different contents of the two solder pastes. The soldering of SMD and TH elements was also observed and evaluated using a combined fingerprint.