材料科学
共聚物
聚苯乙烯
铜
掠入射小角散射
溅射沉积
化学工程
薄膜
形态学(生物学)
氧化物
沉积(地质)
环氧乙烷
纳米技术
溅射
复合材料
聚合物
散射
冶金
光学
小角中子散射
古生物学
物理
中子散射
工程类
沉积物
生物
遗传学
作者
Simon J. Schaper,Franziska C. Löhrer,Senlin Xia,Christina Geiger,Matthias Schwartzkopf,Pallavi Pandit,Jan Rubeck,Björn Fricke,Susann Frenzke,A. Hinz,Niko Carstens,Oleksandr Polonskyi,Thomas Strunskus,Franz Faupel,Stephan V. Roth,Peter Müller‐Buschbaum
出处
期刊:Nanoscale
[Royal Society of Chemistry]
日期:2021-01-01
卷期号:13 (23): 10555-10565
被引量:19
摘要
Copper (Cu) as an excellent electrical conductor and the amphiphilic diblock copolymer polystyrene-block-poly(ethylene oxide) (PS-b-PEO) as a polymer electrolyte and ionic conductor can be combined with an active material in composite electrodes for polymer lithium-ion batteries (LIBs). As interfaces are a key issue in LIBs, sputter deposition of Cu contacts on PS-b-PEO thin films with high PEO fraction is investigated with in situ grazing-incidence small-angle X-ray scattering (GISAXS) to follow the formation of the Cu layer in real-time. We observe a hierarchical morphology of Cu clusters building larger Cu agglomerates. Two characteristic distances corresponding to the PS-b-PEO microphase separation and the Cu clusters are determined. A selective agglomeration of Cu clusters on the PS domains explains the origin of the persisting hierarchical morphology of the Cu layer even after a complete surface coverage is reached. The spheroidal shape of the Cu clusters growing within the first few nanometers of sputter deposition causes a highly porous Cu-polymer interface. Four growth stages are distinguished corresponding to different kinetics of the cluster growth of Cu on PS-b-PEO thin films: (I) nucleation, (II) diffusion-driven growth, (III) adsorption-driven growth, and (IV) grain growth of Cu clusters. Percolation is reached at an effective Cu layer thickness of 5.75 nm.
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