Stencil Printing of Solder Paste for Fine‐pitch Surface Mount Assembly

The increasing availability and use of fine pitch integrated circuit packages place increased demands on the stencil printing process for solder paste deposition. To attain the resolution needed for high assembly yields, both materials and operating parameters must be optimised. The resultant deposits must be uniform and of the proper geometry to promote satisfactory device placement and reflow. This paper summarises findings in the following areas: