光子学
计算机科学
电子工程
炸薯条
材料科学
光电子学
工程类
电信
摘要
Conventionally, active alignment techniques are used in most photonics alignment applications. Active alignment techniques can require costly and sophisticated tooling system for high volume manufacturing. Besides, this technique is time consuming and sometimes gets very complex due to the photonic design complexity. A purely Passive photonic alignment technique is very useful in some application considering all the drawbacks of active alignment. Due to the advancement of wafer fabrication and mode converter designs, passive photonic alignment is now a possible solution. Here, we established a new technique to bond a 24-channel fiber array to a V-Groove photonic chip with simplicity and a more robust system. Industry standard insertion losses were achieved on multiple optical packages applying this technique.
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