Preparation and Properties of Thermal Interface Materials

Thermal interface material is one of the key materials for IC packaging, which is to reduce the contact thermal resistance between electronic devices and heat sinks. Thermal interface materials directly affect the performance and service life of electronic devices. In this chapter, the progress in development of preparation and properties of thermal interface materials is reviewed. We first introduce the conception of thermal interface materials. We then introduce the recent progress in three kinds of thermal interface materials, including polymer-based thermal interface materials, metal-based thermal interface materials, and carbon-based thermal interface materials. The main challenges for the development of thermal interface materials are analyzed, and the potential applications of thermal interface materials in the new fields are prospected.