背板
材料科学
薄膜晶体管
光电子学
有源矩阵
晶体管
氧化铟锡
氧化物薄膜晶体管
兴奋剂
薄脆饼
纳米技术
集成电路
亮度
逻辑门
电子线路
实现(概率)
功率消耗
柔性电子器件
数码产品
遮罩(插图)
删除
阈值电压
电效率
过程(计算)
电子工程
功率(物理)
灵活的显示器
电路设计
失真(音乐)
有机电子学
阳极
佩多:嘘
电压
CMOS芯片
偏压
作者
Yizhe Wang,Haifeng Wu,Xu Chen,Xudong Yang,Jian Hu,Qijun Zong,Weihuang Xiao,Ziwei Li,Ziyang Gan,Xiaoming Zhao,Kexin Hao,Sitong Chen,Bobo Tian,Junjie Zhang,Xiaoqin Liao,Xiao Wang,Dong Li,Anlian Pan
出处
期刊:Nano Letters
[American Chemical Society]
日期:2025-12-18
卷期号:25 (52): 18091-18099
标识
DOI:10.1021/acs.nanolett.5c05130
摘要
The realization of ultrabright Micro-LED displays critically depends on the ability of backplane driving circuits to deliver high current densities to each pixel. Here, we report a high-performance transistor technology based on ultrathin indium tin oxide (ITO), which offers superior electrical properties compared to conventional TFT backplane. To address the challenge of high carrier concentration in ITO─typically manifesting as a degenerate semiconductor─we introduce a controllable in situ oxidation and thickness regulation process to modulate the doping concentration. The optimized ITO TFT backplanes are monolithically integrated with Micro-LED chips at the wafer level, contributing 8.4% of the total power consumption for the integrated microdisplay. Luminance values of 3.7 × 106 nits for blue and 1.6 × 107 nits for green emission are also achieved, meeting the demands of high-brightness applications. This work presents a new strategy for high-current-density Micro-LED driving and provides a practical pathway toward scalable, ultrabright microdisplay technologies.
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