Infrared analysis of temperature distribution on the surface of a populated PCB

The paper is the result of thermovision experiments regarding the measurements of the temperature distribution on the surface of populated printed circuit board (PCB) in order to develop evaluation methods for solder joints quality as result of soldering process and for electronic modules “in circuit” functional tests. In the paper are presented and analyzed the methods emphasizing the differences between solder joints resulting from different soldering processes via analysis of their functional temperatures in the same electrical parameters of the measurement circuits.