稳健性(进化)
无损检测
特征提取
可靠性(半导体)
灵敏度(控制系统)
计算机科学
微波食品加热
网格
特征(语言学)
镜头(地质)
声学
电子工程
微波成像
材料科学
振幅
梁(结构)
信号处理
算法
光学
信号(编程语言)
工程类
计算
特征选择
作者
Yi Xie,Yuan Zhao,Feng Xiao Sun,Heng Jia Liu
标识
DOI:10.1088/2631-8695/ae370c
摘要
Abstract Microwave non-destructive testing (NDT) is particularly suitable for detecting defects in non-metallic materials due to its ability to penetrate and interact with internal structures. This paper proposes a microwave near-field NDT technique based on a sensor grid scanning method, enhanced by a standard open-ended rectangular waveguide(OERW) equipped with a gradient-index(GRIN) metasurface(MS) lens for beam focusing. The detection algorithm integrates frequency-domain and time-domain analyses of S-parameters to achieve comprehensive defect quantification. Frequency-domain analysis facilitates rapid and efficient measurement of defect lateral dimensions using only the amplitude of S11 at the center frequency, without requiring complex algorithms. To overcome the challenge of extracting longitudinal information, a novel feature extraction algorithm for time-domain S-parameters is developed, enabling precise estimation of defect burial depth. In addition to depth characterization, both simulation and experimental results demonstrate that the loaded lens significantly enhances detection sensitivity and lateral resolution, improving the distinguishability of small or closely spaced defects. In simulations, two groups of defects with 12 different burial depths demonstrated the effectiveness of the proposed feature extraction algorithm for estimating burial depth. To further validate the innovation in time-domain S-parameter analysis, experimental tests were performed using 13 specimens with varying burial depths (5 in Group-I and 8 in Group-II). Linear regression analysis yielded R² values of 96 for Group-I and 0.95 for Group-II, confirming the robustness and reliability of the proposed method in quantitatively detecting defect burial depth. Overall, both simulation and experimental results demonstrate that this technique offers high computational efficiency, eliminates the need for complex imaging algorithms, and represents a meaningful advancement in the detection and evaluation of defects in non-metallic materials.
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