Thermal atomic layer etching of amorphous and crystalline Al2O3 films

无定形固体 材料科学 氧化物 金属 蚀刻(微加工) 热分解 氟化物 配体(生物化学) 无机化学 化学工程 图层(电子) 结晶学 化学 纳米技术 有机化学 冶金 生物化学 受体 工程类
作者
Jessica A. Murdzek,Adarsh Rajashekhar,Raghuveer S. Makala,Steven M. George
出处
期刊:Journal of vacuum science & technology [American Institute of Physics]
卷期号:39 (4) 被引量:29
标识
DOI:10.1116/6.0000995
摘要

Thermal atomic layer etching (ALE) can be achieved with sequential, self-limiting surface reactions. One mechanism for thermal ALE is based on fluorination and ligand-exchange reactions. For metal oxide ALE, fluorination converts the metal oxide to a metal fluoride. The ligand-exchange reaction then removes the metal fluoride by forming volatile products. Previous studies have demonstrated the thermal ALE of amorphous Al2O3 films. However, no previous investigations have explored the differences between the thermal ALE of amorphous and crystalline Al2O3 films. This study explored the thermal ALE of amorphous and crystalline Al2O3 films. HF, SF4, or XeF2 were used as the fluorination reactants. Trimethylaluminum (TMA) or dimethylaluminum chloride (DMAC) were used as the metal precursors for ligand-exchange. Spectroscopic ellipsometry measurements revealed that the amorphous Al2O3 films had much higher etch rates than the crystalline Al2O3 films. When using HF and TMA at 300 °C, the amorphous Al2O3 film was removed at an etch rate of 0.78 Å/cycle. For the crystalline Al2O3 film, an etch rate of 0.06 Å/cycle was initially observed prior to the stoppage of etching after removing about 10 Å of the film. Thermal ALE with HF and DMAC resulted in similar results. Etch rates of 0.60 and 0.03 Å/cycle were measured for amorphous and crystalline Al2O3 films at 300 °C, respectively. Other fluorination agents, such as SF4 or XeF2, were also used together with TMA or DMAC for Al2O3 ALE. These reactants for fluorination and ligand-exchange were able to etch amorphous Al2O3 films at 300 °C. However, they were unable to etch crystalline Al2O3 film at 300 °C beyond the initial 10–20 Å surface layer. The investigations also examined the effect of annealing temperature on the etch rate per cycle using HF and TMA as the reactants at 300 °C. Amorphous Al2O3 films were etched at approximately the same etch rate of 0.78 Å/cycle until the crystallization of amorphous Al2O3 films at ≥ 880 °C. The differences between amorphous and crystalline Al2O3 thermal ALE could be used to obtain selective thermal ALE of amorphous Al2O3 in the presence of crystalline Al2O3.

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