Thermoelastic Wave‐Based Logic for Mechanically Cognitive Materials

ABSTRACT Recent advances in metamaterials and fabrication techniques have revived interest in mechanical computing. Contrary to techniques relying on static deformations of buckling beams or origami‐based lattices, the integration of wave scattering and mechanical memory presents a promising path toward efficient, low‐latency elastoacoustic computing. This work introduces a novel class of multifunctional mechanical computing circuits that leverage the rich dynamics of phononic and locally resonant materials. These circuits incorporate memory‐integrated components, realized here via metamaterial cells infused with shape memory alloys which recall stored elastic profiles and trigger specific actions upon thermal activation. A critical advantage of this realization is its synergistic interaction with incident vibroacoustic loads and the inherited high speed of waves, as opposed to recent adaptations of mechanically intelligent systems that employ innately slower mechanisms such as elastomeric shape changes and snap‐through bistabilities. Through a proof‐of‐concept physical implementation, the efficacy and reconfigurability of the wave‐based gates are demonstrated via output probes and measured wavefields. Furthermore, the modular design of the fundamental gates can be used as building blocks to construct complex combinational logic circuits, paving the way for sequential logic in wave‐based analog computing systems.