偷看
粘附
材料科学
表面改性
结晶度
扫描电子显微镜
表面能
等离子体
各向同性腐蚀
复合材料
聚醚醚酮
等离子体刻蚀
化学工程
蚀刻(微加工)
聚合物
图层(电子)
物理
工程类
量子力学
作者
David Gravis,Grégoire Rigolé,Mayssa Yengui,Wolfgang Knapp,Jean‐François Coulon,Fabienne Poncin‐Epaillard
标识
DOI:10.1002/ppap.202100009
摘要
Abstract To understand both chemical and anchoring aspects of Al adhesion, the poly‐ether‐ether‐ketone (PEEK) surface was plasma‐textured before being coated. The practical adhesion was compared with that obtained by laser texturing. The surfaces and assemblies were characterized by scanning electron microscopy, atomic force microscopy, surface free energy determination, and pull‐off tests. Patterning processes increase Al adhesion. O 2 plasma appears to be the most efficient through a texture assigned to the chemical erosion, whereas Ar plasma mostly induces material etching with thermal effects altering the PEEK crystallinity. With low‐pressure plasmas, this texturing can be added to the chemical functionalization to further increase the adhesion.
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