聚酰亚胺
材料科学
热导率
复合材料
碳化硅
石墨烯
填料(材料)
纳米线
电导率
图层(电子)
纳米技术
化学
物理化学
作者
Wen Dai,Jinhong Yu,Yi Wang,Yingze Song,Fakhr E. Alam,Kazuhito Nishimura,Cheng‐Te Lin,Nan Jiang
摘要
3DSG incorporated into a polyimide matrix greatly enhanced its thermal conductivity (up to 2.63 W m−1 K−1), approximately a 10-fold enhancement in comparison with that of neat polyimide.
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