吸附
铜互连
表面扩散
曲率
扩散
再分配(选举)
铜
材料科学
沉积(地质)
化学物理
化学
纳米技术
物理
热力学
几何学
数学
冶金
地质学
物理化学
古生物学
沉积物
政治
政治学
法学
作者
Daniel Josell,Thomas P. Moffat,Daniel Wheeler
出处
期刊:Journal of The Electrochemical Society
[The Electrochemical Society]
日期:2007-01-01
卷期号:154 (4): D208-D208
被引量:59
摘要
Bottom-up superconformal feature filling during electrodeposition, called "superfilling," that is used for industrial processing of damascene copper interconnects has also been demonstrated during electrodeposition of silver and gold. The curvature enhanced accelerator coverage (CEAC) mechanism has been proposed to underlie all three processes and has been used to quantitatively predict observed filling of patterned features. The key feature of the CEAC mechanism is redistribution of adsorbed additives through changes of local surface area as dictated by mass conservation and the relative strengths of adsorption. Previous studies of CEAC-mediated superfilling have neglected adsorbate diffusion along the surface that might arise during deposition due to the CEAC-induced gradients in surface coverage. This paper extends the CEAC model to include such diffusion, applying the resulting formulation to understand differences in the geometries of experimental superfilling systems.
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