材料科学
固溶体
电阻率和电导率
合金
固溶强化
溶解度
冶金
降水
沉淀硬化
色散(光学)
加工硬化
固体溶解度
电导率
工作(物理)
复合材料
应变硬化指数
硬化(计算)
铜
材料的强化机理
锆
铌
拉伤
杂质
锆合金
退火(玻璃)
作者
Seyed Amir Ghaffari,H. Nayeb Hashemi,Richard J. Murphy
标识
DOI:10.1115/imece1994-1324
摘要
Abstract The effects of Nb as a solid solution element on the strengthening and conductivity of pure Cu were studied. Arc-melting was used to produce the alloys. Precipitation of Nb particles in local regions (islands) was observed in alloys with as little as 0.05 wt% Nb. In the Cu alloy with 23 wt% Nb, a thin layer of Nb was detected on the surface of the melted button, which could be an indication of the liquid immiscibility in the Cu-Nb system. The mechanical and electrical properties of Cu-0.1 wt% Nb at various stages of cold work were compared with that of pure Cu with a similar cold work path. The strength of Cu-0.1 wt% Nb was found to be 6% higher than that of Cu at various stages of cold work. Through the electrical resistivity measurements, room temperature solubility limit of Nb in Cu is determined to be 0.0086 at % (0.013 wt%Nb). It is then shown that this amount of Nb in solid solution form contributes only 0.19% to strengthening of Cu. The remaining strengthening is attributed to the dispersion and strain hardening mechanisms.
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