材料科学
复合材料
电阻率和电导率
聚氨酯
胶粘剂
导电体
丙烯酸酯
抗剪强度(土壤)
电子包装
电导率
聚合物
共聚物
物理化学
图层(电子)
电气工程
化学
工程类
环境科学
土壤科学
土壤水分
作者
Yuexi Chen,Yi He,Jiayu Guo,Xiazhen Yang,Bing Guo,Hangyan Shen,Xiaorong Wang
标识
DOI:10.1016/j.ijadhadh.2023.103388
摘要
Electrically conductive adhesives (ECAs) are mainly used in integrated circuit (IC) packaging, light-emitting diode (LED) packaging and other electronic industries to replace traditional solders and lead-free solders. The electrical conductivity and mechanical properties are contradictory with an increase in the content of conductive fillers. Therefore, there is a continuous need to improve electrical conductivity without serious damage to the mechanical properties of ECAs. In this work, a tetra-functional polyurethane acrylate oligomer was used as the main composition of silver filled one-component ECAs to improve performance. By introducing the tetra-functional oligomer, low volume resistivity with good adhesion characteristics was achieved. The volume resistivity and lap shear strength of the silver flake filled ECAs were studied systematically. The ECA with 30.6 vol% content of silver flakes exhibits low volume resistivity of 1.02 × 10−7 Ω m, with a lap shear strength of 8.995 MPa.
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