CMOS芯片
点间距
探测器
大幅面
光电子学
基点
像素
电气工程
固定模式噪声
材料科学
物理
光学
工程类
作者
Josep Maria Margarit,G. Vergara,V. Villamayor,R. Gutiérrez-Álvarez,C. Fernández-Montojo,Lluís Terés,Francisco Serra-Graells
出处
期刊:IEEE Journal of Solid-state Circuits
[Institute of Electrical and Electronics Engineers]
日期:2015-09-02
卷期号:50 (10): 2394-2405
被引量:23
标识
DOI:10.1109/jssc.2015.2464672
摘要
Mid-wavelength infrared (MWIR) thermography is an emerging technology with promising applications such as industrial monitoring, medicine and automotive, but its use in high-speed cameras is not yet widespread due to the lack of inexpensive sensor integration solutions and their common reliance on bulky cooling mechanisms. This work fills the gap by presenting a monolithic uncooled high-speed imager based on vapor-phase deposition lead selenide (VPD PbSe) photoconductors and a fully digital and configurable CMOS read-out integrated circuit (ROIC) to operate the MWIR imager. This ROIC features cancellation of PbSe dark current, compensation of its output capacitance and correction of the fixed pattern noise (FPN) caused by process non-uniformities in CMOS fabrication and detector deposition. The low-cost 80 × 80 imager has been integrated using 0.35 μm 2P4M standard CMOS technology and PbSe detector post-processing with 135 μm pixel pitch and 68% fill factor values. Experimental opto-electrical performance exhibits 10 bit real-time FPN compensation and DR calibration over the entire focal plane operating at 2 kfps, sub-0.5 LSB inter-pixel crosstalk, sub-μW pixel power consumption, and an overall figure of merit of 55 mK × ms.
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