A dismantlable photoadhesion system fabricated by an anionic UV curing of epoxy resins with a base amplifier having a disulfide bond

ABSTRACT A base amplifier (BA) that autocatalytically generates a diamine having a disulfide bond has been developed. Diamines generated from this BA are integrated into cross‐linked networks of epoxy resins that also have disulfide bonds. Anionic UV curing is performed using a photobase generator, the BA and the epoxy resins, and cured films are obtained after UV irradiation and subsequent heating at 160 °C. Furthermore, this curing system is applied successfully to adhesion of two stainless substrates, which is cancelled with gentle heating and a shear force. © 2017 Wiley Periodicals, Inc. J. Polym. Sci., Part A: Polym. Chem. 2018 , 56 , 237–241