微通道
压力降
热阻
散热片
材料科学
热的
热流密度
机械
可重入
工作(物理)
传热
热力学
物理
凝聚态物理
作者
Daxiang Deng,Guang Pi,Weixun Zhang,Peng Wang,Ting Fu
出处
期刊:Entropy
[MDPI AG]
日期:2018-12-25
卷期号:21 (1): 16-16
被引量:18
摘要
This work numerically studies the thermal and hydraulic performance of double-layered microchannel heat sinks (DL-MCHS) for their application in the cooling of high heat flux microelectronic devices. The superiority of double-layered microchannel heat sinks was assessed by a comparison with a single-layered microchannel heat sink (SL-MCHS) with the same triangular microchannels. Five DL-MCHSs with different cross-sectional shapes-triangular, rectangular, trapezoidal, circular and reentrant Ω-shaped-were explored and compared. The results showed that DL-MCHS decreased wall temperatures and thermal resistance considerably, induced much more uniform wall temperature distribution, and reduced the pressure drop and pumping power in comparison with SL-MCHS. The DL-MCHS with trapezoidal microchannels performed the worst with regard to thermal resistance, pressure drop, and pumping power. The DL-MCHS with rectangular microchannels produced the best overall thermal performance and seemed to be the optimum when thermal performance was the prime concern. Nevertheless, the DL-MCHS with reentrant Ω-shaped microchannels should be selected when pumping power consumption was the most important consideration.
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