欧姆接触
材料科学
退火(玻璃)
扫描电子显微镜
合金
金属
电阻率和电导率
接触电阻
表面粗糙度
冶金
表面光洁度
原子力显微镜
分析化学(期刊)
复合材料
纳米技术
化学
工程类
图层(电子)
色谱法
电气工程
作者
Meng Qian Xue,Caiping Wan,Nian Nian Ge,Heng Yu Xu
标识
DOI:10.4028/www.scientific.net/msf.1045.186
摘要
In order to understand the contribution of various metals in the formation of ohmic contacts, Ni/Al/Ti ohmic contacts on n-type 4H-SiC in terms of a different annealing temperature and Ti composition are investigated, which is more difficult to form than p-type ohmic contact. The formation of the Ni/Al/Ti metal alloy system is much more sensitive to metal composition than annealing conditions. With the increase of metal composition, the contact with a high Ti content yields a lower specific contact resistivity compared with the low Ti contact. The annealed surface morphology and phase resultants were examined by scanning electron microscopy (SEM) and atomic force microscope (AFM), respectively. With the increase of Ti components, the surface morphology of the samples becomes more uniform and smoother, while the surface roughness remains unchanged. It implies that Ti metal can not only reduce the ohmic resistance, but also protect the surface of the sample and maintain the roughness.
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