The welding kinetics of interface evolution and mechanism in IN718 alloy solid-state welding

The welding kinetics of interface evolution and mechanism inIN718 alloy solid-state welding are investigated systematically by comparing the hot compression behavior of the separated samples and conventional samples in the temperature range of 1000 °C–1160 °C and strain rate range of 0.1/s to 5/s. The separated samples obtain higher peak stress than conventional samples, and the kinetics analysis results show that separated samples provide higher structural factors and deformation activation energy. The activation energy of the interfacial microstructure evolution of the IN718 alloy was calculated to be 29.7948 kJ/mol. The evolution mechanism of the interface microstructure is characterized by the elimination of the interface second phase and the migration of straight interfacial grain boundaries (IGBs), which is inseparable from the occurrence of interfacial dynamic recrystallization. Interfacial dynamical recrystallization helps to regulate the chemical potential around the second phase for a continuous dissociation. The migration mechanism of the IGBs is influenced by the strain rates, which is continuous dynamic recrystallization (CDRX) for high strain rates and discontinuous dynamic recrystallization (DDRX) for low strain rates.