Pseudo‐Vertical Schottky Diode with Ruthenium Contacts on (113) Boron‐Doped Homoepitaxial Diamond Layers

Electrical properties of pseudo‐vertical Schottky barrier diodes (pVSBDs) prepared on (113)–oriented boron‐doped diamond (BDD) layers using ruthenium (Ru) for both the ohmic and Schottky contacts are investigated. First, Ru ohmic contacts are evaporated on homoepitaxial BDD layers with different resistivity, and their specific contact resistance is measured using circular transfer length method structures after annealing at various temperatures up to 750 °C. Then, pVSBD structures are fabricated on the boron‐doped bilayer consisting of a lower, heavily boron‐doped layer ensuring an ohmic contact and an upper, lightly doped layer providing a rectifying Schottky contact. After necessary mesa etching, both contacts are formed by the Ru evaporation. The results show that Ru forms a stable ohmic contact with very low contact resistance (10 −5 –10 −6 Ω cm 2 ) when deposited on BDD layers with metallic conductivity. It also provides an acceptable Schottky contact on low‐doped (113) homoepitaxial BDD. Both contacts, which are made simultaneously, realize pVSBDs with low on‐state resistance and low forward voltage drop. However, the lower barrier of the ruthenium contacts results in higher leakage. Ru pVSBDs thus show a lower rectification ratio, higher leakage, and a worse ideality factor compared to analogical pVSBDs using molybdenum contacts.