The Effect of Geometric and Material Uncertainty on Debonding Warpage in Fan-Out Panel Level Packaging

With the advantages of high-use efficiency and low production cost, Fan-Out Panel Level Packaging (FOPLP) has become a high-profile advanced packaging technology in the market. However, in FOPLP, processes such as Compression molding, Post Mold Cure (PMC), and Debonding process are performed sequentially. These processes will cause the temperature of the inner package to rise and fall repeatedly, resulting in warpage. There are two main reasons for warpage: Coefficient of Thermal Expansion (CTE) mismatch between the two different materials, and the curing shrinkage of the thermosetting material Epoxy Molding Compound (EMC) due to heat. Since excessive warpage leads to yield and reliability issues, this study will use the Finite Element Method (FEM) to investigate the warpage of the PLP process and apply Process Modeling Technology during simulation. Furthermore, extensive literature results show that the warpage of FOPLP tends to be asymmetric. This phenomenon is primarily due to the inconsistency in thickness and material properties caused by machine tilt, shrinkage of the epoxy, etc., which will also be discussed in this study. The simulation results show that geometric and material uncertainty will directly cause the asymmetric after the debonding process, in addition, the release path of debonding also plays a significant role in the pattern of the warpage.