跨导
材料科学
化学气相沉积
光电子学
晶体管
高电子迁移率晶体管
电子迁移率
宽禁带半导体
异质结
击穿电压
金属有机气相外延
邻接
分析化学(期刊)
电压
外延
化学
纳米技术
电气工程
图层(电子)
有机化学
工程类
色谱法
作者
David F. Brown,Rongming Chu,S. Keller,Steven P. DenBaars,Umesh K. Mishra
摘要
N-polar high electron mobility transistors (HEMTs) were fabricated from GaN/AlGaN/GaN heterostructures grown on n-type vicinal C-face SiC substrates by metalorganic chemical vapor deposition. The heterostructures had a sheet charge density and mobility of 6.6×1012 cm−2 and 1370 cm2 V−1 s−1, respectively. HEMTs with a gate length of 0.7 μm had a peak transconductance of 135 mS/mm, a peak drain current of 0.65 A/mm, and a three-terminal breakdown voltage greater than 150 V. At a drain bias of 20 V, the current-gain and power-gain cutoff frequencies with the pad capacitances de-embedded were 17 and 33 GHz, respectively.
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