A study on the cure characteristics of epoxy/diaminodiphenylmethane system prepared at room temperature

Abstract The curing behavior and kinetics of epoxy resin with diaminodiphenylmethane (DDM) as the curing agent was studied by many researchers, however all of them prepared the system at a high‐temperature condition (i.e., T ≥ 80°C). In this study, a mixture of epoxy/DDM was prepared at ambient temperature and its curing characteristics were studied by using differential scanning calorimetry (DSC). The autocatalytic model was used to calculate the kinetic factors in the dynamic experiments. The kinetics of the curing reaction was also evaluated by two different isoconversional models; namely Friedman method and the Advanced Isoconversional method proposed by Vyazovkin to investigate the activation energy behavior during the curing reaction. The activation energy of the curing reaction was found to be in the range of 48 ± 2 kJ/mol and might be considered to be constant during the curing. In fact, our findings were different from the result reported by other researchers for the system which was prepared at elevated temperature. Therefore, it seems that the preparation temperature of the samples influenced considerably on the curing behavior of epoxy with DDM. Finally, a time–temperature–transformation (TTT) diagram was established to determine the cure process and glass transition properties of the system. © 2010 Wiley Periodicals, Inc. J Appl Polym Sci, 2010