焊接
材料科学
微观结构
复合材料
箔法
冶金
复合数
无定形固体
抗剪强度(土壤)
接头(建筑物)
纳米
金属间化合物
锡膏
合金
结晶学
建筑工程
化学
土壤水分
土壤科学
工程类
环境科学
作者
Yong Xiao,Zhiquan Song,Li Shan,Dan Li,Zhihao Zhang,Mingyu Li,Russell Goodall
标识
DOI:10.1016/j.msea.2020.139691
摘要
Ni-foam reinforced Sn-based composite solder was employed to join ultrafine grain 7075 Al alloy with the assistance of ultrasound. The solder seam was mainly composed of Ni skeletons, Sn-based solder, α-Al phase and very fine (hundreds of nanometers to several microns diameter) Ni3Sn4 particles. Discontinuous networks surrounded by the fine Ni3Sn4 and α-Al particles were in-situ formed in the solder seam, the diameter of which was decreased with increasing soldering time. Smooth transition of the lattice from Al substrate to Sn-based solder was achieved by the formation of an amorphous Al2O3 interlayer at the interface. The microstructure evolution mechanism and the amorphous Al2O3 interlayer formation mechanism are discussed in detail. The shear strength of Al/Ni-Sn/Al joints increased with prolonging soldering time. The Al/Ni-Sn/Al joint ultrasonically soldered for 60 s exhibits a shear strength of 71.4 MPa, which was approximately 37% higher than that soldered with pure Sn solder.
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