材料科学
电介质
氮化硼
复合材料
热导率
环氧树脂
碳化硅
微尺度化学
介电损耗
纳米颗粒
复合数
碳化硼
纳米技术
光电子学
数学教育
数学
作者
Lihua Zhao,Zhijie Chen,Junwen Ren,Lingyu Yang,Yuchao Li,Wenbin Zhong,Wenjun Ning,Shenli Jia
标识
DOI:10.1016/j.jcis.2022.07.058
摘要
Polymer-based dielectrics with high thermal conductivity and superb dielectric properties hold great promising for advanced electronic packaging and thermal management application. However, integrating these properties into a single material remains challenging due to their mutually exclusive physical connotations. Here, an ideal dielectric thermally conductive epoxy composite is successfully prepared by incorporating multiscale hybrid fillers of boron nitride microsphere (BNMS) and silicon dioxide coated silicon carbide nanoparticles ([email protected]2). In the resultant composites, the microscale BNMS serve as the principal building blocks to establish the thermally conductive network, while the nanoscale [email protected]2 as bridges to optimize the heat transfer and suppress the interfacial phonon scattering. In addition, the special core–shell nanoarchitecture of [email protected]2 can significantly impede the leakage current and generate a great deal of minicapacitors in the composites. Consequently, favorable thermal conductivity (0.76 W/mK) and dielectric constant (∼8.19) are simultaneously achieved in the BNMS/[email protected]2/Epoxy composites without compromising the dielectric loss (∼0.022). The strategy described in this study provides important insights into the design of high-performance dielectric composites by capitalizing on the merits of different particles.
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