二极管
CMOS芯片
电容器
材料科学
光伏系统
光电子学
电气工程
炸薯条
激光二极管
发光二极管
电压
电子工程
工程类
作者
Yung‐Jr Hung,Jen-Chien Shih,Jian-Fu Liao,Liang-Xuan Lan,Ying‐Chi Chen
标识
DOI:10.1109/led.2021.3099738
摘要
This letter presents a vertically-stacked photovoltaic (PV)/bypass diode (BPD) module fabricated via localized substrate removal and flip-chip assembly with the aim of improving shadow performance under Gaussian laser illumination. The proposed scheme also prevents the direct illumination of BPDs to eliminate reverse current leakage. The proposed PV/BPD module achieved output voltage (electrical power) of 4.24V (1.6 mW) in a small form factor (4.84 mm 2 ), as well as a linear shadow response with -0.118 mW electrical power loss per shaded PV cell. Under laser misalignment conditions (>0.4 mm shift), the electrical power generated by the PV/BPD module was 2~4 times higher than that of a PV module without BPD. The fact that the PV and BPD chips can both be fabricated using foundry bulk CMOS processes facilitates the integration of the proposed module with sensor circuits and/or (super)capacitors to form a compact self-powered system.
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