电磁屏蔽
电磁干扰
数码产品
电磁兼容性
干扰(通信)
电气工程
电子包装
材料科学
工程类
机械工程
频道(广播)
作者
Zeyu Zheng,Xinyin Gu,Yang Liu,Ting Xin,Jianhui Zeng,Jialin Wen,Hebin Zhang,Weijing Wu,Yan‐Jun Wan,Pengli Zhu,Rong Sun
摘要
To meet the challenges of Moore's law, next-generation chips have been constructed with increasingly complex multilayer architectures.
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