Enhancing directional thermal conductivity in hexagonal boron nitride reinforced epoxy composites through robust interfacial bonding

材料科学 复合材料 环氧树脂 六方氮化硼 氮化硼 热导率 硼 热的 六方晶系 石墨烯 纳米技术 结晶学 物理 气象学 有机化学 化学
作者
Mostafa Mehdipour,Semih Doğan,Marjan Hezarkhani,Kuray Dericiler,Muhammet Nasuh Arık,Cennet Yıldırım,Bertan Beylergi̇l,Mehmet Yıldız,Burcu Saner Okan
出处
期刊:Polymer Composites [Wiley]
卷期号:46 (3): 2740-2755 被引量:34
标识
DOI:10.1002/pc.29136
摘要

Abstract Establishing a robust interfacial bond between hexagonal boron nitride (h‐BN) plates and the epoxy matrix is essential for enhancing heat transfer, which is difficult because of h‐BN's low‐surface energy, tendency to clump together, and the chemical inertness of the epoxy matrix. This research shows different techniques for treating the surface of h‐BN fillers by applying acids and thermal processes to activate the surface. The silanization process was used to increase the silane content on the surface of activated h‐BN in order to make it more compatible with the epoxy matrix. X‐ray photoelectron spectroscopy analysis revealed silicon peaks (Si 2 s peak at 150.1 eV and Si 2 p peak at 100.3 eV) in the spectrum of silane‐treated samples. Heat treatment resulted in the production of more oxygen molecules on the shell of h‐BN compared to the acid treatment. Here, the primary focus was on examining how surface treatment affects thermal conductivity (TC) performance in both in‐plane and through‐thickness paths. There was an increase in the epoxy's TC perpendicular to the plane, going from 0.21 to 0.47 (W/mK), showing a remarkable 123.8% enhancement by adding 10 wt% of silane‐modified‐thermal treated h‐BN particles. The improvement resulted from effectively silanizing the exterior boundary of h‐BN particles, enhancing connection and distribution in the epoxy matrix. Surface modification of h‐BN‐epoxy composites improves TC, leading to better heat conduction in thermal management systems, benefiting industries like aerospace, automotive, and energy systems. Highlights Silanization of h‐BN for better filler‐matrix bonding leading to improved heat transfer Boosting thermal conductivity in the through‐thickness direction with surface‐modified h‐BN Significant improvement in through‐thickness thermal conductivity with treated h‐BN. Thermal treatment of h‐BN produced better oxygenation than acid treatment. Application in aerospace and automotive through improved heat transfer.
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