硅
材料科学
多晶硅
光电子学
单片微波集成电路
薄脆饼
图层(电子)
微波食品加热
化学气相沉积
复合材料
薄膜晶体管
CMOS芯片
电信
计算机科学
放大器
作者
H.S. Gamble,B.M. Armstrong,S.J.N. Mitchell,Y. Wu,Vincent Fusco,J.A.C. Stewart
出处
期刊:IEEE Microwave and Guided Wave Letters
[Institute of Electrical and Electronics Engineers]
日期:1999-01-01
卷期号:9 (10): 395-397
被引量:159
摘要
The authors propose a solution to the surface conduction problem in silicon monolithic microwave integrated circuits (MMIC's). An LPCVD polycrystalline silicon layer is deposited over the surface of a high-resistivity silicon wafer which is then covered with a silicon dioxide layer. The polycrystalline silicon layer effectively removes, through traps, any free electrons or holes that may have been induced at the oxide-silicon interface. The CPW lines with 1.25-μm aluminum metallization on passivated HRS substrates have an attenuation loss at 30 GHz of only 1.08 dB/cm.
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